Hardware & Compute

Flex Pays $4.4B for EPC Power as AI Data Centers Push 800V Architecture

Flex’s $4.4B EPC Power deal adds 800V DC and grid-forming technology as AI data center rack densities rise and operators rethink power delivery.

Get smart on it

Flex is acquiring a power-conversion company for $4.4 billion to gain technology for 800V electrical systems in AI data centers. As AI facilities increase their power density, the way electricity is converted and distributed from the grid to computing equipment is becoming a critical part of infrastructure design rather than a supporting component. The acquired company's technology is designed to move power at higher voltage with lower current, reducing losses and consolidating functions traditionally handled by multiple systems, while also responding rapidly to the fluctuating power demands of AI workloads. The acquisition signals that managing electrical systems has become as important as managing computing equipment itself in next-generation AI infrastructure.

The biggest AI stories, once a day

One short email a day with the stories that matter. Free. Unsubscribe with one click.

Relevant courses

Want to go deeper than the news? Explore live, cohort-based AI courses taught by practitioners.

Browse AI courses on Maven
Related news
Hardware & ComputeOpen story →

Google Unveils TPU 8i Max and TPU 8tx: A Dual-Chip TPU and a Confidential TPU

Google has added two new systems to its eighth-generation TPU lineup. TPU 8i Max targets massive context windows and rack density. TPU 8tx targets secure, confidential inference. Google TPU 8i Max is a dual-chip package built from 2 TPU 8i chips. Both arrive alongside TPU 8t and TPU 8i, announced in April. TL;DR Size: TPU 8i Max = 2 TPU 8i chips in 1 package. TPU 8tx = TPU 8t silicon plus 5th Gen AMD EPYC hosts. Runs on: Google Cloud TPU systems. Performance: 8i Max doubles TPU 8

Also reported by Data Center Knowledge

Hardware & ComputeOpen story →

IBM Announces IBM Quantum Nighthawk r3: A New Processor to Support 10k Quantum Operations on 520 Programmable Qubits

IBM has announced IBM Quantum Nighthawk r3, its next superconducting quantum processor. It is designed to run 10,000 quantum operations accurately across 520 programmable qubits. In 2027, IBM plans to link 2 r3 chips into a single 1,040-qubit system. For developers, the announcement is speed. The current Nighthawk r2 already runs workloads up to 19x faster than IBM’s earlier processors. TL;DR Size: Nighthawk r3: 520 programmable qubits, 2,034 physical qubits, 10 l-couplers. Nightha

Hardware & ComputeOpen story →

Why the data center you dread might never even be built

The data center boom is running into serious real-world obstacles, from widespread local opposition and permitting delays to a scramble for electricity. Before those challenges even come into play, though, there’s a more basic problem: A lot of the projects being announced may never get built in the first place. With billions of dollars in AI infrastructure […]

Hardware & ComputeOpen story →

How backlash and red tape continue to slow data centers post-Blue Wave

The data center boom is running into serious real-world obstacles, from widespread local opposition and permitting delays to a scramble for electricity. Before those challenges even come into play, though, there’s a more basic problem: A lot of the projects being announced may never get built in the first place. With billions of dollars in AI infrastructure […]

Hardware & ComputeOpen story →

AMD Launches Epyc SP7, Helion as AI Rack Demand Rises

AMD has begun shipping sixth-gen Epyc servers and is rolling out Helion AI racks, signaling a bigger push into enterprise and agentic AI infrastructure.

Hardware & ComputeOpen story →

Google broadens its AI hardware portfolio with two new specialized chips

Google's new tensor processing units (TPUs) broaden its chip portfolio to more use cases: confidential model training and more memory capacity.